Presentation recordings (click to expand)
AC Core Loss
Keynote: High Frequency Effects in the Core (Gerald Hurley, National University of Ireland, Galway) |
Magnetics Core Dimensional Effects - Flux Propagation in Ferrites (Marcin Kacki, SMA Magnetics) |
Panel Discussion (Hurley, Kacki) |
Series-coupling Characterization of High-Leakage Magnetic Components (John Hayes, University College Cork) |
Lumped Transmission Line Model for Displacement and Conductive Eddy Currents in Ferrite Cores (Charles Sullivan, Dartmouth) |
Standardized Testing and Data Sheets (Seung Ryul Moon, National Energy Technology Laboratory) |
Panel Discussion (Hurley, Hayes, Sullivan, Moon) |
Thermal Management of Power Magnetics
Keynote: Recent Trends in Design and Techniques to Influence Thermal Performance of Magnetic Components (Peter Wilson, University of Bath) |
Thermal Issues Associated with the Design of Solid State Transformers (Subhashish Bhattacharya, NCSU FREEDM) |
Getting the Heat Out (George Slama, Wurth Elektronik) |
Spice Modelling of the Transformer Losses and Thermal Based Verifications (Qichen Yang, Georgia Tech RISE) |
Panel Discussion (Wilson, Bhattacharya, Slama, Yang) |
Closing Remarks: What Is Right With Magnetics (Alexander Gerfer, Wurth Elektronik) |
Presentation slides (click to expand)
Technical Session - Design and Optimization of Magnetics for Different Applications
- Keynote: Precision Power Magnetics Engineering: A Key Step toward High Performance Power Electronics (Minjie Chen, Princeton University)
- Magnetics Integrations for 2.5D and 3D Packaging (Ranajit Sai, Tyndall)
- Inductive Components on Silicon Substrate 300 mm Wafer (Jens Kehl, Wurth Elektronik)
- Ferrite Technology in Transition - Process and Shaping (Sebastian Bachmann, Tridelta Weichferrite)
- Thin Film Magnetics (John McDonald, Atlas Magnetics)
Technical Session - Thermal Design and Other Special Issues: Partial Discharge, Insulation, etc.
- Keynote: Electrical Parameter Integration (Charles Sullivan, Dartmouth College)
- Variable Inverter/Rectifier Transformers and other Coupled Electronic and Magnetic Systems (Mike Ranjram, Arizona State University)
- Magnetics Design for LLC Circuit Topology (Lukas Mueller, Micrometals)
- Designing Soft Saturating, Low Loss TLVR´s Avoiding Air Gaps for Better Coupling and Highly Efficient Nanocrystalline Power Core Material (Michael Freitag, Yageo)
Presentation slides (click to expand)
Technical Session - AC Core Loss
- Keynote: High Frequency Effects in the Core (Gerald Hurley, National University of Ireland, Galway)
- Magnetics Core Dimensional Effects - Flux Propagation in Ferrites (Marcin Kacki, SMA Magnetics)
- Series-coupling Characterization of High-Leakage Magnetic Components (John Hayes, University College Cork)
- Lumped Model to Explain and Approximate Dimensional Effects in Ferrite Cores (Charles Sullivan, Dartmouth)
- NETL’s Core Loss Testing and Advanced Data Sheets for Soft Magnetic Materials (Seung Ryul Moon, National Energy Technology Laboratory)
Technology Demonstrations Session
- Development of Distributed Gap Powder Core Materials to Address Higher Frequency Applications 1 MHz at High Operating Temperature Ranges (Chris Oliver, Micrometals)
- Emerging Magnetic Materials and Magnetic Structures (John Lynch, Fair-Rite)
- Fundamentals of L, R, Z Measurments (Jenna Pollock, Independent)
- Materials Magic Nanocrystalline, Amorphous and Powdered Amorphous Cores (Ken’ichi Chata’ni, TOKIN, A Kemet Company)
- Multiscale Nanolaminated Metallic Cores for High Frequency Magnetics (Mark Allen, University of Pennsylvania)
- Pulse Testing of Magnetic Cores and Inductors (JC Sun, Bs&T)
- Soft Magnetic Metal-flake Composite Material Suitable for High Frequency Power Modules (Ken’ichi Chata’ni, TOKIN, A Kemet Company)
- Strain Annealed Metal Amorphous Nanocomposite Soft Magnetic Materials (Seung Ryul Moon, National Energy Technology Laboratory)
Technical Session - Thermal Management of Power Magnetics
- Keynote: Recent Trends in Design and Techniques to Influence Thermal Performance of Magnetic Components (Peter Wilson, University of Bath)
- Thermal Issues Associated with Design of Solid State Transformers (Subhashish Bhattacharya, FREEDM Systems Center)
- Getting the Heat Out (George Slama, Wurth Elektronik)
- Spice Modeling of Transformer Losses and Thermal-Based Verifications (Qichen Yang,Florida State University)
Closing Remarks