3D PEIM

February 1-3, 2023
Hosted by Florida International University, Miami, FL, USA

Registration Open - Early Cost-Saving Fees Expire December 1st

PSMA and IEEE invite you to attend the Fourth Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-2023). This Symposium provides the opportunity to drive future power electronics solutions for increased density and performance. Discover advances in the design, package integration and manufacturing of 3D power sources. Technical Sessions include modeling, active and passive components, substrates, packaging and how to integrate them with 3D manufacturing technologies to create state of the art power sources.

The Symposium will be held February 1-3, 2023, at Florida International University, Miami, FL, USA., offering an opportunity to get a "winter warm-up" on Florida's enticing beaches.

Created and supported by the PSMA's Packaging & Manufacturing Committee, 3D-PEIM will feature invited papers highlighted by plenary and keynote addresses and contributed presentations by Industry and Academia experts. Speakers will address design, thermal, materials, reliability, and manufacturability issues. There will also be Exhibits and an Exhibit Sponsor's Session. Ample opportunities will be provided to network with attendees, speakers and exhibitors.

The Symposium is headlined with an excellent list of Plenary Speakers comprised of International Power Technology leaders from Industry and Academia.

Plenary Speakers

• Dr. Brandon Passmore, Wolfspeed, "Finite-Element Predictive Modeling for Power Modules."
• Prof. Madhavan Swaminathan, Georgia Tech, "Integrated Power Delivery for AI Computing: Technology Gaps & Opportunities."
• Professor Fred C. Lee, Virginia Tech, USA, "PCB based Integrated Magnetics."
• Professor Rao Tummala, Georgia Tech, USA, "Future of packaging of role of power integration."
• Professor Katsuaki Suganuma, University of Osaka, Japan, "Superior heat dissipation by low-pressure Ag sinter joining and real-time AI lifetime prediction for SiC power module."
• Dr. Mahadevan Iyer, Amkor, "Emerging Power electronics packaging and system integration for automotive applications."

In addition, the program is comprised of 14 Technical Sessions run in a single path over 3 days. Not a single session needs to be missed.

The General Chair is Dr. Markondeyaraj Pulugurtha of the Florida International University (FIU).

Technical Program Co-Chairs are Dr. John Bultitude of Kemet, a Yageo Company, and Dr. Vanessa Smet from Georgia Tech.

Complete Program Now Available at http://www.3d-peim.org/program/

Program at a Glance:
S2: IVR for Computers and Servers; Chair: Siddarth Ravichandran, Chipletz
S3: Multiphysics Design & Tools; Chair: Rajen Murugan, Texas Instruments
S4: Additive Manufacturing; Chair: Peter Friedrichs, Infineon
S5: Manufacturing Technologies; Chair: Jason Rouse, Taiyo America
S7: Materials I Interconnects & Lead Attachments; Chair: Andy Mackie, Indium Corporation
S8:  Materials II Substrates & Encapsulants; Chair: Ninad Shahane, Texas Instruments
S9: Module Integration; Chair: Cyril Buttay, Laboratoire Ampère, Lyon
S11: Thermal Management and Reliability; Chair: Patrick McCluskey, University of Maryland
S12: Passive Component Integration; Chair: John Bultitude, KEMET Corporation
S13: Low Power & Telemetry; Chair: Girish Wable, Jabil
S15: Tour of FIU Labs; Chair: Markondeyaraj Pulugurtha, Florida International University

REGISTRATION IS OPEN at Registration - 3D PEIM (3d-peim.org)

For additional information visit http://www.3d-peim.org  

You are invited to sign up for Partnership Tabletop Exhibit Opportunities
Each Exhibit Partner has the opportunity to present products at the Symposium with an Exhibit Table, Presentation at the Symposium (Diamond and Platinum Level), and on a 3D-PEIM Virtual Tabletop Website page. To learn more and be an Exhibit Partner, visit www.3d-peim.org/sponsors-exhibitors/.

Diamond Exhibit Partners:

Platinum Exhibit Partner:		Gold Exhibit Partner:

Technical Sponsors:

Media Sponsors:

Provided by Arnold Alderman,
3D-PEIM 2023 Publicity Chair

The third International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) was another success! On June 21-23, 2021, 75 international participants from Asia, Europe and the Americas attended a 100% virtual 3-day symposium. In spite of COVID-19 restrictions requiring the Japan hosted symposium to go fully virtual, all registered and speaking participants were in attendance.

The Symposium attendees received great insight from each of the plenary presentations given by leading experts in power electronics: "Optimal modularization technology for the latest WBG devices" by Yoshikazu Takahashi, Tohoku University, Japan, "Automotive Semiconductors in the CASE era and its 'Jisso' technologies" by Yasushi Shinojima, MIRISE Technologies Corporation, "Materials and Technologies for Power Electronic Module" by Prof. Dr.-Ing. Habil Hans-Jürgen Albrecht, IAVT TU, "Diamond Devices Based on Unique Material Properties" by Toshiharu Makino, AIST, Advanced Power Electronics Research Center, "Applications with SiC Power Devices for Railcar" by Tomonobu Mihara, Mitsubishi Electric Corporation, and "Reliability Aspects of 3D Integrated Power Devices" by Dr. Josef Lutz, Professor at Chemnitz University of Technology.

The Symposium Sessions were kicked off with outstanding keynote talks given by leading experts in power packaging: "Thermal Fluid Simulation Modeling and Structural Analysis of Double-sided Cooling Power Module Based on Thermal Transient Test" by Tom Hara, ‎Siemens Digital Industries Software, "Developments of High Power Blue Diode Laser Systems for Laser Metal Deposition and Selective Laser Melting in Additive Manufacturing" by Masahiro Tsukamoto, Joining and Welding Research Institute, Osaka University, "Development of High Performance SiC Power Module" by Dr. Hiroshi Yamaguchi, National Institute of Advanced Industrial Science and Technology (AIST), "Superior Reliability of Power Electronic Packages with Die Top Systems (DTS®). Why a Wire-Based Technology Solution Outperforms Clip-Based Interconnections" by Michael Joerger, Heraeus Electronics, and "The Technology Race in Power Electronics Packaging: The race is on!" by Rainer Frauwallner AT & S Austria Technologie & Systemtechnik Aktiengesellschaft.

The keynotes were followed by a single-track technical program featuring 21 invited oral presentations divided into seven topical sessions, several with a keynote speaker followed by invited/contributed talks. The presenters and attendees engaged in lively discussions during the question periods in each session.  In addition, 100% of participant feedback stated that attendees felt the presented material was high quality and were interested in attending a future 3D-PEIM either in person or virtually.

The videos and pdf's of the presentations are available to all registered attendees and through post conference registration at Registration - 3D PEIM (3d-peim.org).

The Symposium was sponsored by the Power Sources Manufacturers Association (www.psma.com), and chaired by Prof. Tsuyoshi Funaki, Osaka University, Japan. IEEE EPS was a technical sponsor and financial support was provided by nine industry sponsors.

Planning is now underway for 3D-PEIM 2023 which will be chaired Associate Prof. P.M. Raj at Florida International University. If you are interested in helping to organize or participate, please contact info@3D-PEIM.org, or the PSMA office at power@psma.com.

General Chair Prof. Tsuyoshi Funaki,  Osaka University	Technical Program Chair Prof. Guo-Quan (GQ) Lu, Virginia Tech USA	Technical Program Chair Prof. Katsuaki Suganuma,  Osaka University	Technical Program Chair Minora Ueshima,  Daicel, Japan	Steering Committee Chair Brian Narveson, PSMA Packaging Committee Co-Chair

The second International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) was another success! On June 25-27, 2018, over 70 participants, 22 from outside the US, attended the eventin College Park, Maryland. Prior to the technical program, three tutorials were

 given by leading experts on additive manufacturing and power electronics system integration: "Additive Manufacturing" by Prof. Christopher Williams of Virginia Tech; "System Integration" by Prof. Douglas Hopkins of NC State University; and "Integrated Thermal Packaging" by Prof. Michael Ohadi of University of Maryland. Attendee reviews of the tutorials were outstanding with over 90% feeling that their knowledge was increased due to the presentations.

The Symposium was kicked off with two outstanding keynote talks given by two leading researchers in power packaging: "Small, Quiet, Robust, and Affordable: Delivering the Integrated Promise" byProf. Mark Johnson, University of Nottingham, UK; and "Embedding Technologies for Planar Power Electronics Modules" by Prof. Rolf Aschenbrenner, Fraunhofer Institute-Berlin, Germany.
The keynotes were followed by a single-track technical program featured 34 oral presentations divided into eight topical sessions, each with a keynote speaker followed by three invited/contributed talks. Over 80% of the oral talks were invited. The presenters and attendees engaged in lively discussions during the sessions and many networking breaks.  In addition, 19 posters were displayed during an exciting interactive session with the displaying students.  Participant feedback stated that 90% of attendees felt the presented material was high quality and were interested in attending a future 3D-PEIM.

Plans are now underway for 3D-PEIM 2020 in Osaka, Japan, and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com. 

Technical Program Chair Prof. Guo-Quan (GQ) Lu,  Virginia Tech

General Chair Prof. Patrick McCluskey, University of Maryland, College Park

 

The first International Symposium on 3D Power Electronics and Manufacturing was a true success! On June 13-15, 2016, over 80 participants, 11 from outside the US, attended the 1st International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) in Raleigh, North Carolina. The symposium offered 39 presentations in 11 sessions, and began with three tutorials that focused on “The World of Packaging Technologies and Critical Issues” taught by Professors Douglas Hopkins, Guo-Quan Lu, and Patrick McCluskey.

A highlight was the Plenary Road Mapping session chaired by Brian Narveson, PSMA, with keynote speeches from Chuck Richardson, iNEMI on “2017 iNEMI Roadmap Process and a Preview of Selected IoT/Wearables, Packaging & Board Assembly Chapter Highlights”, Bram Ferreira, Technical University of Delft on “International Technology Roadmap for Wide Band-gap Power Semiconductors”, and Bill Chen, ASE-US and IEEE CPMT, on “Heterogeneous Integration for IoT, Cloud and Smart Things”.

The Symposium was organized by the Power Sources Manufacturers Association (www.psma.com), chaired by Prof. Doug Hopkins of North Carolina State University, and supported by 15 exhibitors and sponsors, including the FREEDM Systems Center at NCSU, CPES at Virginia Tech, and CALCE at University of Maryland.

Of special note: SARDA Inc. selected the 3D-PEIM Symposium to announce its collaboration with UTAC and AT&S to implement its Heterogeneous Integrated Power Stage (HIPS). All three were exhibitors and/or presenters.

Plans are now underway for 3D-PEIM 2017 and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.

Prof. Douglas Hopkins, General Chair
Prof. Patrick McCluskey, Technical Program Co-Chair
Prof. G.Q. Lu, Technical Program Co-Chair

Provided by Prof. Douglas Hopkins, General Chair

The presentations from the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing are available on the Packaging Forum.