Safety & Compliance Forum

Scope
This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source ( e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A

Scope
This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

The IPC-7093A standard provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093A provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.

-21F Ball Grid Array Task Group

Chair  Robert Rowland, Axiom Electronics, LLC

Staff Liaison Andres Ojalill

Committee Charter   This task group is responsible for the maintenance and further development of IPC-7095, Design and Assembly Process Implementation for BGAs. This document covers the characteristics for all elements of developing a cohesive product that uses BGA packages as components in the electronic assembly. In addition, there are recommendations for void acceptability and defect analysis.