Safety & Compliance Forum

Scope
This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source ( e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A

Scope
This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types is also addressed. The focus on the information contained herein is
on critical inspection, repair, and reliability issues associated with BGAs.
1.1 Purpose The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic assembly, inspection, and repair processes. The intent is to provide useful and practical information to those who are using BGAs and those who are considering BGA implementation.
1.2 Selection Criteria (Determination of Package Style and Assembly Processes) Every electronic system consists of various parts: interfaces, electronic storage media, and the printed board assembly. Typically, the complexity of these systems is reflected in both the type of components used and their interconnecting structure. The more complex the components, as judged by the amount of input/output terminals they possess, the more complex is the intercon- necting substrate.
Cost and performance drivers have resulted in increased component density, and a greater number of components attached to a single assembly, while the available mounting real estate has shrunk. In addition, the number of functions per device has increased and this is accommodated by using increased I/O count and reduced contact pitch.
Reduced contact pitch represents challenges for both assemblers and bare board manufacturers. Assemblers encounter handling, coplanarity and alignment problems.
The board manufacturers must deal with land size issues, solder mask resolution and electrical test problems.
Based on industry predictions one would believe that all component packages have over 200 I/Os and are increasing in I/O count. Actually, components with the highest usage have I/O counts in the 16 to 64 I/O range. Over 50% of all components fall into this category, while only 5% of all components used have over 208 I/Os, which may be the threshold for determining the crossover point between peripheral leaded component style packages and array type formats.
Many peripherally leaded, lower I/O count devices, such as memory and logic devices, are being converted to area array packaging formats as either BGAs or Fine Pitch BGAs.

Working Draft

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7-12 Microsection Subcommittee

SCOPE
This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages.

5-21F Ball Grid Array Task Group

D-61B Rigid Printed Electronics Design Standard Task Group

Chair       Jeff Shubrooks, Raytheon Company

Vice Chair    Pratyush Rai, Nanowear Inc.

Staff Liaison Chris Jorgensen

Committee Charter   This group is developing IPC-2294, Design Standard for Printed Electronics on Rigid Substrates, which will establish specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive or nonconductive.

The IPC-7093A standard provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093A provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.

IPC-2294 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to IPC-2294 standard, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid...

This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: those assemblies that are assembled with lead-containing or lead-free solder; components that have lead-containing or lead-free second level interconnect terminal finishes and materials; the maximum component temperature not to be exceeded during assembly

The IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095E provides the useful and practical information to those who use or are considering using BGAs. IPC-7095E provides descriptions on how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-15

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-16

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts.  This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14.4

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14.4

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model.