Technology Report - 3D Power Packaging with Focus on Passive Embedded Components and Substrate Technologies (2018)

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This is the third in a series of reports focusing on using 3D packaging to reduce the size and improve the performance of Power Sources.  The focus of this report is on passive and substrate technologies. Georgia Tech Packaging Research Center under contract from the PSMA Packaging Committee have systematically surveyed the recent advances in passives-active embedding and 3D passive-active integration to generate this report. Emerging nanomaterials and processes are described for inductors, capacitors and resistors. Key enabling building-blocks are described for each technology. The manufacturing challenges are also highlighted. Roadmaps are projected for passive component advances and active embedding technologies. Available as a soft copy on USB only.

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