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International Symposium on 3D Power Electronics Integration and Manufacturing 3D-PEIM 2020

June 22-24, 2020
Osaka University, Japan

PACKAGING is a Design Function
MANUFACTURING provides the Design Rules





The Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-20) will be held on June 22-24, 2020.  This symposium will be held at the Osaka University, Suita Campus in Japan. This is the first time to have this symposium outside the USA. It will include worldwide experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. Asia is the factory of the world and has a big customer base for advanced power electronics technology. 3D-PEIM is an excellent opportunity to learn about leading edge R&D innovations in 3D power packaging. The focus of the symposium will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

The conference will feature invited lectures highlighted by a keynote addresses from Industry experts.  There will also be tutorials, technical sessions that include contributed presentations, exhibits, and an interactive poster/demonstration session. The symposium is being organized by the Power Sources Manufacturers Association (www.psma.com), and will be chaired by Prof. Tsuyoshi Funaki of the Osaka University, Japan.

Session topics during the 3-day symposium include:

  • Systems Integration & Thermal Management
  • Multiphysics Design and Tools
  • Materials
  • Manufacturing Technologies: equipment and processes
  • Heterogeneous Integration of Components
  • Quality & Reliability

University of Osaka School/Graduate School of Engineering

Osaka is located in the center of Kansai region, facing Osaka bay. About 9 million people live in Osaka, the largest component of the Keihanshin Metropolitan Area, the second largest metropolitan area in Japan. Osaka was historically developed as a town of merchants. It has also been known as the nation's kitchen. Osaka contains numerous urban canals and bridges, including its most famous urban canal, Dotonbori. Osaka Castle, one of the most famous landmarks in Osaka, played a major role in the Japanese history.

 

Osaka University School of Engineering, is a university born from the needs of industry. The Osaka Technology School, the predecessor of the School of Engineering, was founded as a powerful cooperative effort between the industry of the time and the government. The School of Engineering was the first in Japan to establish specialized academic departments for fields such as fermentation, welding, communications, and the environment. The nature of Osaka with its comparatively unrestricted atmosphere and the course of development in close cooperation with local industries has produced a unique set of departments that is not restrained by orthodox department structures. The Osaka School of Engineering utilizes a range of opportunities to maintain their important relationships with local communities, including the holding of courses that are open to the public, and University-Industry collaboration projects at the Center for Advanced Science and Innovation.


The Symposium will include a table top exhibition area. Interested organizations are invited to purchased exhibit space that will include a table to exhibit products and literature to a target group of technologists. Symposium Sponsorship is also available which includes one registration, tutorial registration, an exhibit table, Website and program recognition, lecture room recognition, and a banner displayed in the lecture room. Interested in being an exhibitor or sponsor of 3D-PEIM 2020, contact info@3d-peim.org.

Call for Papers coming in October. Visit http://www.3d-peim.org/call-for-papers/ for information when available.

If you are interested in learning more, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.  We look forward to seeing you in Osaka university this coming June 2020.

Prof. Tsuyoshi Funaki
Osaka University
General Chair,
3D-PEIM Symposium 2020

 Prof. Katsuaki Suganuma,
Osaka University,
Technical Program Co-Chairman

 
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