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An Exploratory Discussion Leading to PwrSoC2020
Oct. 31- Nov. 1, 2019
Skysong Innovation Synergy II, Arizona State University This Workshop uniquely spotlights technology and manufacturing advancement of
miniaturization and integration of power conversion and power management solutions.
 he Power Sources Manufacturers Association (PSMA), in partnership with IEEE Power Electronics Society (PELS), is sponsoring a Workshop on Packaging and Integration in Power Delivery at Arizona State University's SkySong Innovation in Scottsdale, AZ October 31-Nov. 1, 2019. This two half-day event is An Exploratory Workshop Leading to the 2020 International Workshop on Power Supply on Chip (PwrSoC), in Philadelphia, PA.
In recent years, the overall form factor of power electronic devices have scaled-down significantly for a broad range of applications and power levels. This two-half day workshop will focus on two topics related to power delivery in a package:
- Power system in package (PSIP) power modules
- Process and integration of multi-die power delivery in package.
Invited speakers from both industry and academia will address the challenges and opportunities in miniaturization and efficiency power delivery in application areas. Each session will consist of presentations followed by active discussions between IC designers, assembly experts and substrate/materials providers bringing innovative solutions to address the packaging challenges in power delivery products.
The workshop will be held at Arizona State University's SkySong Innovation in Scottsdale, AZ. The General Chair is Professor Hongbin Yu from ASU's School of Electrical, Computer and Energy Engineering, who has participated in many of the prior PwrSoC workshops.The Technical Program Chair for the workshop is Jim Doyle from Dialog Semiconductor, who was a keynote presenter at the PwrSoC2018. The support team for the workshop includes Arnold Alderman representing PSMA, Francesco Carobolante representing IEEE PELS, and Prof. Hanh-Phuc Le, Dept. of Electrical, Computer, and Energy Engineering, the University of Colorado at Boulder who is currently IEEE PELS Topic 2 Committee Chair. Workshop General Chair Professor Hongbin Yu commenting on this workshop's venue: "We are excited to have this workshop in Phoenix area, where there are many microelectronics companies that are very active in developing new semiconductor devices that require innovation in the scaling of power integration and provide much-improved efficiency. Through this workshop, we hope to foster much stronger collaboration between academia and industry resulting in new and key contributions in power delivery innovations."
Technical Program Chair Jim Doyle from Dialog Semiconductor points out "The workshop will bring together technical experts on SOC packaging mainly from the Phoenix area. The line between pure integration and multichip SIPs have become blurry since processes such as InFo, MCeP,WLP/RCP,WL-esip, 3D TSV offered by different foundries and packaging companies, provide effective solutions competitive with full integration. These options could revolutionize the decision to integrate or not to integrate. Join us to learn more about the options and trade-offs."
| Confirmed Invited Speakers |
| Cian O'Mathuna, Tyndall National University, Ireland | PSIP and PwrSoC: Past and Future | | Intel Corporation, Chandler, AZ | Power Supply in Multi-die Packaging | | Karim Arabi, Atlazo | Low Power Packaging in IoT Applications | | Shinko, Tempe, AZ | Embedded Dies and Passive Integration | | Ian Kent, Dialog Semiconductor, U.S.A. | Power Supply in a Package | | John Pigott, NXP Chandler AZ | Package & Circuit Interactions and Automotive Applications | | Mark Gerber, ASE | New Generation Power Packaging Technology | See the completeprogram at the workshop website: http://pwrsocevents.com/pwrpack-workshop-at-asu/
Registration will be open until October 31st, 2019, and is available through the workshop website.
Sign-up for a Partnership Opportunity by sending an email to yuhb@asu.edu, or Jim.Doyle@diasemi.com
There are two levels of company partnerships available:
- Platinum level provides an exhibit table for the duration of the workshop, two free registrations to all events, plus the Gold-level banner and logo display opportunities.
- The Gold level provides one free registration to all events, provides company visibility through banner, logo displays at workshop events, in the technical program, in website and announcement emails.
Host 
Sponsors:
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Provided by: |
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Hongbin Yu,
General Chair |
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Jim Doyle
Technical Program Chair |
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