3D-PEIM 2020
Osaka University, Japan
June 22-24, 2020

PACKAGING is a Design Function
MANUFACTURING provides the Design Rules

he Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-20) will be held on June 22-24, 2020.  This symposium will be held at the Osaka University, Suita Campus in Japan. This is the first time to have this symposium outside the USA. It will include worldwide experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. Asia is the factory of the world and has a big customer base for advanced power electronics technology. 3D-PEIM is an excellent opportunity to learn about leading edge R&D innovations in 3D power packaging. The focus of the symposium will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

The conference will feature invited lectures highlighted by a keynote addresses from Industry experts.  There will also be tutorials, technical sessions that include contributed presentations, exhibits, and an interactive poster/demonstration session. The symposium is being organized by the Power Sources Manufacturers Association (www.psma.com), and will be chaired by Prof. Tsuyoshi Funaki of the Osaka University, Japan.

If you are interested in learning more, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.  We look forward to seeing you in Osaka university this coming June 2020.

Prof. Tsuyoshi Funaki General Chair, 3D-PEIM Symposium 2020

Prof. Katsuaki Suganuma, Osaka University, Japan Technical Program Co-Chairman

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.