Arizona State University's SkySong Innovation in Scottsdale, AZ
October 31 – November 1, 2019

The Power Sources Manufacturers Association (PSMA), in partnership with IEEE Power Electronics Society (PELS), is sponsoring a Phoenix Workshop on Packaging and Integration in Power Delivery at Arizona State University's SkySong Innovation in Scottsdale, AZ October 31-Nov. 1, 2019. This two half-day event is An Exploratory Workshop Leading to the 2020 International Workshop on Power Supply on Chip (PwrSoC), in Philadelphia, PA.

The workshop will focus on the integration of miniature solid state power converters in microelectronics package environment, which attracted increasing interest in recent years as electronic devices overall form factor have scaled down significantly in a broad range of applications and power levels. In particular, strategies on how to integrate power delivery in package (PSiP) with more efficiency, smaller form factor, will be one of the focuses of the workshop. The other focus is on how to fit power delivery function into multi-die situation. These will involve the active discussions between IC designers, assembling experts and substrate/materials providers to provide innovative solutions to address power delivery in package challenges.

The workshop will be held at Arizona State University's SkySong Innovation in Scottsdale, AZ. The General Chair is Professor Hongbin Yu from ASU's School of Electrical, Computer and Energy Engineering, who has participated in many of the prior PwrSoC workshops, and the Technical Program Chair for the workshop is Jim Doyle from Dialog Semiconductor, who presented a keynote speech at the PwrSoC2018. The workshop support team includes Arnold Alderman representing PSMA, Francesco Carobolante representing IEEE PELS, and Prof. Hanh-Phuc Le, Dept. of Electrical, Computer and Energy Engineering, the University of Colorado at Boulder who is currently IEEE PELS Topic 2 Committee Chair. 

For more information about the workshop please contact:

General Chair:
Professor Hongbin Yu. yuhb@asu.edu

Technical Program Chair
Jim Doyle. Jim.Doyle@diasemi.com

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