Inaugural 3D Power Electronics Integration and Manufacturing Symposium, June 13-15, 2016, Raleigh, NC, will address the future of power electronics design

he first International Symposium on 3D Power Electronics Integration and Manufacturing (www.3D-PEIM.org), to be held June 13-15, 2016, in Raleigh, North Carolina, is now open for registration. The event brings together designers and manufacturers to address the future of integrated power electronics and advance the 3D power electronics systems designs of the future.

The 3D-PEIM Symposium kicks off on Monday morning, June 13th, with a series of tutorials dealing with “The World of Packaging Technologies and Critical Issues”. Sessions will then continue over three days covering manufacturing techniques, modelling and simulation, materials, passive components, and quality and reliability. The 2+ hour evening receptions on Monday and Tuesday provide opportunities for networking and discussions with the Dialogue Presenters and Exhibitors displaying their latest technologies.

Are you interested in presenting? The Dialogue Session Paper submission is open through June 6, 2016 since we have flexible arrangements and can accommodate additional technical talks. Besides the 2+ hours of discussion time, each Dialogue Speaker gets a full table to display their hardware and resulting products.

Are you interested in Exhibiting or Sponsorship. Each Exhibitor and Sponsor receives a full 8 foot table for their Table-Top Display and a place for their promotions. Exhibits begin Monday noon and continue through Wednesday noon. For more information go to www.3d-peim.org/sponsors.

The 3D-PEIM symposium is underwritten by the Power Sources Manufacturers Association (PSMA) and is supported by: the International Microelectronics Assembly and Packaging Society (IMAPS); the IEEE Components, Packaging and Manufacturing Technology Society (CPMT); North Carolina State University; the University of Maryland; and Virginia Tech.

“This symposium is all about electrical-physical design and the manufacturing of power sources,” said Doug Hopkins, PhD., Professor of Electrical Engineering at NC State and Chairman of 3D-PEIM. “Since we expect nearly everyone will have an interest in ‘physical’ circuits, we’re offering both dialogue and lecture speakers the opportunity to display their hardware during the breaks and receptions.” According to Hopkins, the symposium also offers tutorials to provide “background and insight into many of the traditional physical design approaches and technologies.”

Prof. Douglas Hopkins, General Chair
Prof. Patrick McCluskey, Technical Program Co-Chair
Prof. G.Q. Lu, Technical Program Co-Chair

Provided by Prof. Douglas Hopkins, General Chair

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