RAM Innovations

RAM Innovations is a UK-based company specializing in advanced embedded die packaging for power electronics. RAM’s technology enables the direct embedding of power semiconductor devices into printed circuit boards, delivering significant improvements in size, thermal performance, and electrical efficiency. Focused on wide bandgap devices such as GaN and SiC, RAM supports next-generation power module development for automotive, industrial, and aerospace applications. The company is actively engaged in R&D and international collaborations to drive packaging innovation.