Call for Papers
June 22-24, 2020
Osaka University, Japan

PACKAGING is a Design Function
MANUFACTURING provides the Design Rules

he Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-20) will be held on June 22-24, 2020.  This symposium will be held at the Osaka University, Suita Campus in Japan. This is the first time to have this symposium outside the USA and it will include worldwide experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. Asia is the factory of the world and has an extensive customer base for advanced power electronics technology. 3D-PEIM provides an excellent opportunity to learn about leading edge R&D innovations in 3D power packaging. The focus of this symposium will be on additive manufacturing, embedded component assembly, co-designed and integrative packaging technologies and will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

The conference will feature invited plenary presentation by industry and academic leaders.  Each technical session will be highlighted by a keynote addresses from Industry or Academic expert.  In addition, the technical sessions will include 2 invited and one contributed presentation plus exhibits, and an interactive poster/demonstration session. The symposium is being organized by the Power Sources Manufacturers Association (www.psma.com), and will be chaired by Prof. Tsuyoshi Funaki of the Osaka University, Japan.  You can find additional information at www.3D-PEIM.org. 

Call for Papers Announced – Deadline January 20, 2020

Contributed papers are invited addressing important challenges related to the packaging and manufacturing of smaller, lighter, more efficient, and sustainable power electronic products, especially in the following topic areas:

• Additive Manufacturing
• Embedded Components and Embedding Technologies
• Systems Integration and Thermal Management for High-density Packaging
• Multiphysics Modeling and Simulation of Integrated Packaging and Circuit Solutions
• Materials (e.g., interconnects, encapsulants, substrates)
• Heterogeneous Integration
• Manufacturability of circuits and packaging (manufacturing processes, equipment, and standards)
• Quality and Reliability, including Prognostics and Condition Monitoring

Members of the worldwide electronics community are invited to contribute to the third international symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). This symposium will bring together practitioners and researchers to share, discuss, and roadmap the latest developments in circuits and systems enabled through advancements in 3D packaging, integration, and manufacturing technologies. The symposium will have a full program of keynotes, invited presentations, contributed papers, interactive sessions, table-top exhibits, and laboratory tours.

Abstract Format: The abstract should consist of two pages of text with sections on the purpose of the study, the approach, the results and the significance to power electronics community, plus one page of figures, tables, and references.

ABSTRACT DEADLINE: JANUARY 20, 2020

Submission information is available at http://www.3d-peim.org/call-for-papers/submission-information/

To learn more, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com. 

We look forward to seeing you in Osaka university this coming June 2020.  

General Chair, 3D-PEIM Symposium 2020
Prof. Tsuyoshi Funaki, Osaka University
 
Technical Program Co-Chairs:
Prof. Katsuaki Suganuma, Osaka University
Prof. Guo-Quan (GQ) Lu, Virginia Tech USA
Minora Ueshima, Daicel, Japan

General Chair, 3D-PEIM Symposium 2020 Prof. Tsuyoshi Funaki, Osaka University
Technical Program Co-Chairs:
Prof. Katsuaki Suganuma, Osaka University	Minora Ueshima, Daicel, Japan	Prof. Guo-Quan (GQ) Lu, Virginia Tech USA

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