Toulouse France
April 24-26, 2019

Call for Papers Deadline extended to November 30

he International Workshop on Integrated Power Packaging (IWIPP) is a biennial, multi-disciplinary event focused on the intersection of technology areas that support the development of high-performance packaging for power electronics.  The accelerating commercialization of wide band-gap (WBG) semiconductors has highlighted the importance of developing next-generation packaging techniques to overcome the limitations of legacy packaging solutions.  The establishment of IWIPP represents a concentrated effort to recognize and address this challenge by bringing together the capabilities of industry practitioners and researchers across the globe.

In 2015, IWIPP reemerged after several years of inactivity to address new packaging challenges introduced with the commercialization of WBG semiconductor technology.  Since that time, IWIPP has quickly become a premier international workshop in the area of power electronics packaging and integration. The workshop is sponsored by the IEEE's Power Electronics Society (PELS), Components, Electronic Packaging Society (EPS), and Dielectrics and Electrical Insulation Society (DEIS), as well as the Power Sources Manufacturers Association (PSMA) and the European Consortium on Power Electronics (ECPE). 

IWIPP 2019 will be held April 24-26, 2019, in Toulouse, France. The contents of IWIPP 2019 will include a set of plenary addresses from leading experts in the field, a broad range of technical sessions, as well as a complement of technical tutorial sessions, all of which are included in the registration fee.  Topics that will be addressed as part of the technical program for IWIPP 2019 include magnetic and dielectric materials; power semiconductor devices and modules; integration of sensors; design of gate/base drivers, reliability and manufacturability considerations; electro-magnetic interference mitigation; and many more. 

Please make plans to attend IWIPP 2019 to enhance your understanding of the latest developments in the area of high-performance power packaging and the critical role of packaging in determining the performance and reliability of power electronics applications.  Additional information regarding the workshop can be found at the following website: https://iwipp.org/

Sponsored by:
IEEE Power Electronics Society (PELS)
IEEE Components, Packaging, and Manufacturing Technology Society (CPMT)
IEEE Dielectrics and Electrical Insulation Society (DEIS)
Power Sources Manufacturers Association (PSMA)
European Center for Power Electronics (ECPE)

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