April 8-10, 2025

he next offering of the International Workshop on Integrated Power Packaging (IWIPP) will be held April 8-10, 2025, on the beautiful campus of the University of Alabama. The workshop is being chaired by Andy Lemmon in collaboration with Technical Chairmen Nick Baker and Arthur Boutry. The 2025 workshop will return to a full in-person format after the previous hybrid-format offering in 2022 and the all-virtual corridor event, which was held in 2021.

The International Workshop on Integrated Power Packaging (IWIPP) is a biennial, multi-disciplinary event focused on the intersection of technology areas that support the development of high-performance packaging for power electronics. The workshop is sponsored by the Power Sources Manufacturers Association (PSMA) along with the IEEE Power Electronics Society (PELS), the IEEE Dielectrics and Electrical Insulation Society (DEIS), and the IEEE Electronic Packaging Society (EPS).

IWIPP 2025 will include a set of keynote addresses from leading experts in the field, a broad range of technical sessions, as well as a complement of technical tutorial sessions, all of which are included in the registration fee. Topics that will be addressed as part of the technical program for IWIPP 2025 include magnetic and dielectric materials; power semiconductor devices and modules; integration of sensors; design of gate/base drivers, reliability and manufacturability considerations; electro-magnetic interference mitigation; and many more.

Additional information regarding the workshop can be found at the following website: https://iwipp.org/

Sponsored by:
IEEE Power Electronics Society (PELS)
IEEE Dielectrics and Electrical Insulation Society (DEIS)
IEEE Electronics Packaging Society (EPS)
Power Sources Manufacturers Association (PSMA)

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.