WIPP 2021, a PSMA co-sponsored workshop, will be held April 28th-30th, 2021, on the beautiful campus of Aalborg University, in Aalborg, Denmark. IWIPP is a growing and successful power technology workshop with excellent speakers and networking opportunities.

Under the leadership of General Chairman Dr. Francesco Iannuzzo, Professor, Aalborg University, the International Workshop on Integrated Power Packaging (IWIPP) brings together industry, academic and government researchers in the field of power electronics components, electrical insulating materials, and packaging technologies to facilitate and promote the development and commercialization of high-density and high-efficiency power converters. Invited presentations and contributed papers will range from core materials technology and components to power converters. Presenters will address important challenges and present solutions to increase reliability and manufacturability while targeting improved performance and reduced system cost.

This IWIPP 2021 program includes an exciting set of power technology and packaging Keynote addresses which include:

1. "Packaging, Integration and Fast switching: what has been achieved and what´s next?" - Eckart Hoene, Fraunhofer
1. Only close interaction between packaging end circuit engineers will bring power electronics to the next step. This presentation will give an overview on achievements in packaging and its implementation into commercial products as well as new concepts intended to reduce the technological market barrier.
2. "Environmental Trends and Challenges on Power Packaging" - Garron Morris and Chris Genthe, Rockwell Automation
1. This keynote covers the challenges of increasing power densities, coupled with new environmental stresses stemming from changing customer locations, behaviours, and applications.
3. Electrical Topology of a Pure EV: The Porsche Taycan - Thomas Krauss, Porsche
1. This presentation gives a vivid overview on grid topology, components, construction and packaging in an EV and the issues of its implementation.
4. Paving the Way to Automotive GaN: The Importance of Packaging - Tamara Baksht, ViSiC
1. This presentation will discuss the arrival of the D3GaN era with the novel Depletion-mode Direct Drive GaN technology emerging as an eminently suitable technology meeting the demand of highly reliable and extremely robust product needed in critical drive applications of the electric vehicle market.

Packaging and related technologies are the key to creating high-density power sources. Attendance and participation at this important workshop can keep you and your colleagues on the cutting edge. If you have technology advancements or research accomplishments to present to the community, Technical Chairman Nick Baker, Aalborg University invites you to submit a digest for review by the technical committee.

The call for papers is available at http://iwipp.org/conference/call-for-papers/. The submission portal of the website http://iwipp.org/conference/abstract-submission-page/ opened Sept. 14, 2020. Additional information regarding the workshop can be found at the conference website: https://iwipp.org/ .

TRAVEL RESTRICTIONS DUE TO COVID-19

IEEE, PSMA and the IWIPP 2021 organizing committee are carefully monitoring the developing COVID-19 outbreak. The IWIPP 2021 leadership is committed to supporting conference participants who may be unable to travel to Aalborg, Denmark from affected regions. If an attendee has an accepted paper but does not wish to travel because of COVID concerns, or has concerns with obtaining a VISA, the committee will provide opportunities for remote participation, presentation of her/his paper, and networking.

IWIPP is co-sponsored by the PSMA Packaging Committee, which is co-chaired by Brian Narveson, Ernie Parker and John Bultitude. They look forward to seeing all of you at Aalborg University April 28th-30th, 2021.

Sponsored by:
Power Sources Manufacturers Association (PSMA)
IEEE Power Electronics Society (PELS)
IEEE Electronic Packaging Society (EPS)
IEEE Dielectrics and Electrical Insulation Society (DEIS)
European Center for Power Electronics (ECPE)

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.