he second International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) was another success! On June 25-27, 2018, over 70 participants, 22 from outside the US, attended the eventin College Park, Maryland. Prior to the technical program, three tutorials were given by leading experts on additive manufacturing and power electronics system integration: "Additive Manufacturing" by Prof. Christopher Williams of Virginia Tech; "System Integration" by Prof. Douglas Hopkins of NC State University; and "Integrated Thermal Packaging" by Prof. Michael Ohadi of University of Maryland. Attendee reviews of the tutorials were outstanding with over 90% feeling that their knowledge was increased due to the presentations.

The keynotes were followed by a single-track technical program featured 34 oral presentations divided into eight topical sessions, each with a keynote speaker followed by three invited/contributed talks. Over 80% of the oral talks were invited. The presenters and attendees engaged in lively discussions during the sessions and many networking breaks.  In addition, 19 posters were displayed during an exciting interactive session with the displaying students.  Participant feedback stated that 90% of attendees felt the presented material was high quality and were interested in attending a future 3D-PEIM.

The Symposium was sponsored by the Power Sources Manufacturers Association (www.psma.com), and chaired by Prof. Patrick McClusky, University of Maryland, IEEE EPS was a technical sponsor and with financial support by two industry sponsors, and three academic sponsors, CALCE at University of Maryland, CPES at Virginia Tech, and the FREEDM Systems Center at NCSU.

Plans are now underway for 3D-PEIM 2020 and organizers and sponsors are being solicited. If you are interested, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.

Technical Program Chair Prof. Guo-Quan (GQ) Lu, Virginia Tech

General Chair Prof. Patrick McCluskey, University of Maryland, College Park

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