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February 1-3, 2023
Hosted by Florida International University, Miami, FL, USA
 SMA invites you to attend the Fourth Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-23). This Symposium provides the opportunity to share design progress and to receive an update on the advances in active and passive component design and integration combined with 3D manufacturing technologies for power electronics packaging.The Symposium will be held February 1-3, 2023, at Florida International University, Miami, FL, USA., offering the chance to get a "winter warm-up" on Florida's enticing beaches. Created and supported by the PSMA's Packaging & Manufacturing Committee, 3D-PEIM will feature invited papers highlighted by plenary and keynote addresses and contributed presentations by Industry and Academia experts. Speakers will address mechanical, materials, reliability, and manufacturability issues. There will also be Exhibits and an Exhibit Sponsor's Session. The General Chair is Prof. Markondeyaraj Pulugurtha of the Florida International University (FIU); Technical Program Co-Chairs are Dr. John Bultitude of Kemet, a Yageo Company, and Dr. Vanessa Smet from Georgia Tech. The Chairs are assisted by an Organizing Committee of leading experts in this field. Program at a Glance: - IVR for Computers and Servers; Chair: Siddarth Ravichandran, Chipletz
- Multiphysics Design & Tools; Chair: Rajen Murugan, Texas Instruments
- Additive Manufacturing; Chair:Peter Friedrichs, Infineon
- Manufacturing Technologies; Chair: Jason Rouse, Corning
- Materials I Interconnects & Lead Attachments; Chair: Andy Mackie, Indium Corporation
- Materials II Substrates & Encapsulants; Chair: Ninad Shahane, Texas Instruments
- High Power Module Integration; Chair:Cyril Buttay, Laboratoire Ampère, Lyon
- Thermal Management and Reliability; Chair:Patrick McCluskey, University of Maryland
- Passive Component Integration; Chair: John Bultitude, KEMET Corporation
- Low Power & Telemetry; Chair: Shubhendu Bhardwaj, Florida International University
- Tour of FIU Labs; Chair: Markondeyaraj Pulugurtha, Florida International University
Plenary Speakers
Professor Fred C. Lee, Virginia Tech, USA, "PCB based Integrated Magnetics."
Professor Katsuaki Suganuma, University of Osaka, Japan "Superior Heat Dissipation by Low-pressure Ag Sinter Joining and Real-time AI Lifetime Prediction for SiC Power Module."
Dr Michael Guyenot, Bosch, "Highly Integrated Low Inductance SiC Power Modules."
Dr. Brandon Passmore, Wolfspeed, "Finite-Element Predictive Modeling for Power Modules." Call for Contributed Papers
If you would like to submit a contributed paper for presentation at the Symposium, the Call for Papers is currently open at www.3d-peim.org/call-for-papers. The abstract Submission opened June 1, 2022, and closes on August 12, 2022, Industry, Academia, and Government are invited to submit abstracts on the following technology topics:
- Additive Manufacturing
- High Power Module Integration
- IVR for Computers and Servers
- Low Power & Telemetry
- Manufacturing Technologies
- Materials I Interconnects & Lead Attachments
- Materials II Substrates & Encapsulants
- Multiphysics Design & Tools
- Passive Component Integration
- Thermal Management and Reliability
Registration Will Open on August 1st, 2022. Check back with us at http://www.3d-peim.org You are invited to sign up for Partnership Tabletop Exhibit Opportunities
Each Exhibit Partner has the opportunity to present products at the Symposium and on a 3D-PEIM Virtual Tabletop Website page. To learn more and sign up as an Exhibit Partner, visit http://www.3d-peim.org/sponsors-exhibitors/.
Technical Sponsors:
Media Sponsors:
Provided by Arnold Alderman,
3D-PEIM 2023 Publicity Chair
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