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3D Power Electronics Integration and Manufacturing | |||||||||||||||||
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The Third Biennial International 3D-PEIM-21 Symposium Hybrid (live/virtual) event will occur on June 21-23, 2021,
We are building on the 2016 and 2018 Symposia's successes with the 3D-PEIM-21, again assembling world-class experts representing far-reaching topics on additive, embedded, co-designed, and integrative packaging technologies. In creating the 3D-PEIM Symposium, the PSMA Packaging Committee offers power electronics researchers an excellent opportunity to learn about the latest leading-edge R&D innovations in 3D power packaging. The focus of the Symposium will be on additive, embedded, co-designed, and integrative packaging technologies. Sessions will address mechanical, materials, reliability, and manufacturability issues in deploying smart power-dense components and modules, exploring the path to developing and manufacturing future 3D power electronics systems. Recognizing the importance of the Symposium, all previous speakers signed up for the postponed 2020 3D-PEIM event have committed to participating in our upcoming 2021 3D-PEIM. This Symposium is one of numerous PSMA sponsored events that is part of its ongoing commitment to educate and inform the power electronics industry. The Technical Program Co-Chairs are Prof. Katsuaki Suganuma, Osaka University, Japan, Dr. Minora Ueshima, Senior Manager, Daicel, Japan and Prof. Guo-Quan Lu, Virginia Tech. General Chair Professor Tsuyoshi Funaki states, "I am glad we are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that 3D-PEIM 2021 is held here because there are many power device and peripheral packaging material manufacturers in Japan. We are planning on providing an amazing on-site or virtual experience for all attendees. I also believe that all attendees will gain significantly advanced packaging knowledge through discussions at this event." Technical Program
The detailed program with time zone information for virtual attendees is available at www.3d-peim.org/program. Due to time zone challenges, all sessions will be recorded and available to paid attendees after the Symposium. The Symposium will feature table-top exhibits during the breaks, lunch periods, and evening networking sessions for in-person attendees. Virtual attendees will be able to interact with speakers and the audience during live question and answer sessions. On the last day of the Symposium, in-person attendees are invited on a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery. Additional information and registration details are available at www.3D-PEIM.org. Opportunities Available for 3D-PEIM 2021 Exhibit Partnerships
Technical Sponsors:
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If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE,
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he Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-21) will be held for the first time in Asia on June 21-23, 2021, at the Suita Campus of Osaka University Japan. However due to the Covid19 pandemic, Japan may not be open to foreign travelers, everyone can attend this live event virtually. You can switch between virtual and in-person attendance up to May 21st.
