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Announcing the International Workshop on Integrated Power Packaging | |||||||||
SMA is excited to again be sponsoring the latest edition of IWIPP (2021) which will be held April 28-30th, 2021, on the beautiful campus of Aalborg University, in Aalborg, Denmark. IWIPP is a growing and successful power technology workshop with excellent speakers and networking opportunities. The contents of IWIPP 2021 will include a set of keynote addresses from leading experts, a broad range of technical sessions, as well as a complement of technical tutorial sessions, all of which are included in the registration fee. The International Workshop on Integrated Power Packaging (IWIPP) brings together industry, academic and government researchers in the field of power electronics components, electrical insulating materials, and packaging technologies to facilitate and promote the development and commercialization of high-density and high-efficiency power converters. Invited presentations and contributed papers will range from core materials technology and components to power converters. Presenters will address important challenges and present solutions to increase reliability and manufacturability while targeting improved performance and reduced system cost. Call for Papers Packaging and related technologies are the key to creating high-density power sources. Attendance at this important event can keep you and your colleagues on the cutting edge. If you have technology advancements or research accomplishments to present to the community, please consider submitting a digest for review by the technical committee. The call for papers is available at http://iwipp.org/conference/call-for-papers/. The submission portal of the website will be opening on Sept 1, 2020. Additional information regarding the workshop can be found at the conference website: https://iwipp.org/ . IWIPP is sponsored by the PSMA Packaging Committee, which is co-chaired by Brian Narveson, Ernie Parker and John Bultitude. They look forward to seeing all of you at Aalborg University April 28-30, 2021.
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