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EnaChip Inc.
Trifon Liakopoulos
1606 Vroom Dr.
Bridgewater, NJ 08807
Telephone: 516-849-9367
E-mail: trifon@enachip.com
Website: enachip.com
Enachip, Inc. is an integrated magnetics semiconductor company founded to introduce Wafer Level Magnetic (WLM) technology platform, and a new class of products that it enables: Power-Supply-on-Chip (PwrSoC) and Power-System-in-Package (PSiP). Enachip's game changing technology includes proprietary methods and materials, developed to bridge the gap that separates industry product development efforts from cost-effective manufacturing solutions today.
The company's technical expertise is focused on customized devices using advanced microfabrication methods, and new magnetic materials that enable the manufacturing of high efficiency inductors and transformers that can be used in power management integrated systems, in signal isolation sensitive circuit components where data integrity is critical, as well as in magnetic sensors and electromagnets. The company offers business development experience and product commercialization path in the areas of materials, sensors, magnetics, to enable high impact solutions. Areas of interest include consumer electronics and healthcare products in which small size, low cost, power efficient devices and nanotechnology solutions are the key enablers.
Henkel Electronic Materials
Justin Kolbe
18970 W 78th Street
Chanhassen, MN 55317
Telephone: 952-486-6415
E-mail: justin.kolbe@henkel.com
Website: www.henkel.com
Henkel Electronics is the world's leading and most progressive provider of qualified, materials for semiconductor packaging, printed circuit board (PCB) assembly and advanced soldering solutions. The breadth of Henkel's product portfolio delivers cost-effective solutions for any manufacturing challenge. In hundreds of different ways Henkel electronic adhesives can enhance the quality and efficiency of electronic components.
IBM
Rick Fishbune
3605 Highway 52 North
BLDG 040-2 OFFICE C208
Rochester, MN 55901
Telephone: 507-253-4425
E-mail: fishbune@us.ibm.com
Website: www.ibm.com
IBM has a history of continuous re-invention, transforming itself throughout its 100-plus year history. In the past five decades alone, IBM has ushered in the eras of the mainframe, the personal computer, IT services and enterprise software. In its current transformation, IBM is once again leading the reordering of the technology industry. A number of years ago, the company declared its focus on the strategic forces behind the "digital" revolution; data, cloud and engagement, driven by mobile and social, and underpinned by security.
Because of this transformation, IBM today is much more than a hardware, software and services company; IBM is a cognitive solutions and cloud platform company, with a focus on industry capabilities and expertise.
James T Doyle
Embry Riddle Aeronautical University
5022-2 East Siesta
Phoenix, AZ 85044
E-mail: doylej7@erau.edu
James Doyle has over 35 years of experience as an electrical/ computer design engineer at Honeywell, Motorola, BurrBrown, MCE Semiconductors, National Semiconductors and Intel. In June of 2011, Doyle incorporated a small consulting firm, Doyle Engineering, which specializes in electronic circuitry and telecommunication products. Professor Doyle came to Embry Riddle Aeronautical University after taking a campus tour and inquiring about projects and teaching opportunities. Professor Doyle is a recognized Professional Engineer and a Senior Member of the IEEE.
Mark Scott
Miami University
650 E High Street
260-C Garland Hall
Oxford, OH 45056
Telephone: 513-529-0745
E-mail: scottmj3@miamioh.edu
Dr. Mark Scott received B.S. and M.S degrees in Electrical Engineering and a Ph.D. in Power Electronics from The Ohio State University in Columbus, OH. He joined the College of Engineering & Computing at Miami University in Oxford, OH as an Assistant Professor in 2015. He was awarded a National Science Foundation (NSF) fellowship in 2014 to perform research on the power supplies used in fusion reactors. This fellowship allowed him to travel to Hefei, China, to study the electrical systems of their tokamak.
His research includes applying silicon carbide (SiC) and gallium nitride (GaN) into motor drive systems for electrified vehicles, multilevel inverter topologies, and other renewable energy applications; modeling and mitigation methods of electromagnetic interference (EMI) in power electronics; odeling power electronics for medium-voltage, high-power applications such as Flexible AC Transmission Systems (FACTS) and power supplies for fusion reactors; and studying relationship between human behavior, power consumption, and energy related legislation.
PowerFilm, Inc
Dan Stieler
1287 XE Place
Ames, IA 50014
Telephone: 515-292-7606 x177
E-mail: dstieler@powerfilmsolar.com
Website: www.powerfilmsolar.com
With almost three decades of experience in semiconductor and solar energy research and development, PowerFilm has positioned itself as the leading global developer and manufacturer of thin-film solar products and modules. The company utilizes a unique and proprietary technology platform, enabling the production of low-cost solar modules on a high volume basis. The manufacturing of our material and products is all done in the United States.
Since 1988 PowerFilm has focused on developing thin-film solar module technology through an industrial scale manufacturing process. Elements of the company's low-cost technology and manufacturing process include the use of a durable, flexible plastic substrate; roll-to-roll manufacturing to minimize handling costs; amorphous silicon to avoid dependence on the silicon wafer market; and printed interconnection to automate the cell connection process.
Yang Liu
Sun Yat-sen University
Nami Lou, Sun Yat-sen University, Daxuecheng WaihuanDong Road#132
Guangzhou, GuagDong, 510006, China
Telephone: 86-13318727167
E-mail: liuy69@mail.sysu.edu.cn
Yang Liu received M.S. and Ph.D. degrees in microelectronics and solid-state electronics from Jilin University, Changchun, China, in 1994 and 2000, respectively. From 2001 to 2007, he was with the Research Center for Nano-Device and System, Nagoya Institute of Technology, Nagoya, Japan, where he was involved in GaN power electronic materials and devices research. In 2007, he joined Sun Yat-sen University, Guangzhou, China, as a Professor.
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