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Dusty Becker has been involved in the design and development of DC Rectifiers, DC-DC Converters, and DC Power Systems for both indoor and outdoor applications since joining Emerson in 1968. Dusty has held the positions of Engineer, Design Engineer, Staff Engineer, R&D Manager, Director of Engineering, VP of Operations, VP of Systems Engineering, VP of Product Development, and currently VP of Technology. His current focus is new technology directions in the areas of Power and Outside Plant, including high power delivery systems as well as 380Vdc distribution. Dusty holds three patents and has two patents pending. He is the author of over 30 technical papers and magazine articles on the subject of DC power conversion and distribution. Dusty is a past Co- Chair for the Intelec Technical Committee and is currently a member of the Intelec IEC. Dusty is past Chairman of the PSMA (Power Sources Manufacturing Association) Board of Directors and is Co-Chair of the PSMA Energy Efficiency Committee. Dusty also sits on the NEMA Energy Storage Technical Committee as well as the recently formed IEC TAG for IEC Smart Grid Standardization. Dusty is a member of the Green Grid technical committee - Power Sub-working Group. Dusty is also a member of the E-merge alliance, Data & TelecomTechnical Standards Committee. Provided by Dusty Becker, Vice President of Technology, Emerson Network Power - Energy Systems
 Brian C. Narveson received his BSEE from Iowa State University in 1972. He is currently the President of Narveson's Innovative Consulting, which focuses on coaching Innovation in Engineering and Technical Marketing. Brian has been focused on the power industry for over 20 years. He joined Power Trends in 1992 shortly after it was founded as the Vice President of Engineering. His team developed the products which helped grow the company from less than $1M in sales in 1992 to over $60M in 1999 when it was purchased by Texas Instruments. After the acquisition he became the Marketing and Applications Manager for TI's Power Module business. From this role he advanced to Worldwide Power Marketing Development Manager at TI (2002-2007). From 2007 until he retired from TI in 2011 he was the Midwest Analog Applications Manager for Texas Instruments. Brian has been co-chairman of the PSMA Packaging Committee for 6 years, which sponsored and facilitated the PSMA "PSiP2PwrSoC" Special Project. He has chaired multiple APEC Industry Sessions. In addition Brian serves on the PSMA Technology Roadmap sub-committee focused on DC-DC Converters. He has been involved with PSMA since 2001 when he became the company representative for TI. Brian has attended every APEC since 1994 except one. He has presented 3 technical sessions and co-authored or presented 4 industry sessions. This year he and Ernie Parker are co-chairing the industry session "3D Packaging for Power Electronics" where they have recruited 7 speakers from Industry and Academia. Brian has published over 25 power electronics articles in the US, Asia and Europe. Most were technical, but he also wrote about industry issues such as POLA vs. DOSA. Provided by Brian Narveson, President, Narveson's Innovative Consulting |
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If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and
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our members of the PSMA Board of Directors are elected at the Annual Meeting held every year during the APEC conference. Each Director serves a three year term and is eligible to be reelected for one additional term. We would like you to meet two of the Directors elected at the Annual Meeting on March 18, 2013.