The Third Biennial International 3D-PEIM-21 Symposium Hybrid (live/virtual) event will occur on June 21-23, 2021, Osaka University, Japan

he Power Sources Manufacturers Association (PSMA) announces the opening of registration for the Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-21) to be held June 21-23, 2021, hosted by Osaka University, Japan, at their Graduate School of Engineering. Due to the unforeseen status of the COVID-19 pandemic next June, we have cautiously decided to hold an in-person/virtual hybrid event. Registered individuals can attend either in person or virtual. Presentations will be live from both in-person and virtual presenters. All of the presentations will be recorded and available to paid attendees. Attendees may switch their registration between virtual and in-person up to one month before the Symposium.

3D-PEIM has successfully re-invited all the postponed 2020 program world-class experts to present in 2021. Continuing the 2016 and 2018 Symposia's success, 3D-PEIM-21 again assembles world-class experts from academia and industry representing a far-reaching range of disciplinary perspectives exploring the path to the development and manufacture of future 3D power electronics systems. Created and supported by the PSMA Packaging & Manufacturing Committee, the Symposium encompasses additive, embedded, co-designed, and integrative packaging technologies. Sessions will address mechanical, materials, reliability, and manufacturability issues in deploying smart power-dense components and modules.

PSMA is sponsoring the 3D-PEIM-21 Symposium as part of its ongoing commitment to educate and inform the power electronics industry. Some of the organizations involved in providing Technical Support for the workshop  include CPES/Virginia Tech, Daicel Japan, and the IEEE Electronics Packaging Society.

The Technical Program Co-Chairs are Prof. Katsuaki Suganuma, Osaka University, Japan, Dr. Minora Ueshima, Senior Manager, Daicel, Japan and Prof. Guo-Quan Lu, Virginia Tech.

The detailed program with time zone information for virtual attendees is available at www.3d-peim.org/program. Due to time zone challenges, all sessions will be recorded and available to paid attendees after the Symposium.

General Chair Professor Tsuyoshi Funaki states, "I am glad we are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that 3D-PEIM 2021 is held here because there are many power device and peripheral packaging material manufacturers in Japan. We are planning on providing an amazing on-site or virtual experience for all attendees. I also believe that all attendees will gain significantly advanced packaging knowledge through discussions at this event".

The Symposium will feature table-top exhibits during the breaks, lunch periods, and evening networking sessions. On the last day of the Symposium, in-person attendees are invited on a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery. Additional information and registration details are available at http://www.3d-peim.org/.

Interested in being an Exhibit Partner for  3D-PEIM 2021?  Information can be found at
 http://www.3d-peim.org/sponsors-exhibitors//.  If you have questions, contact info@3d-peim.

Technical Sponsors:

If you or anyone in your company is interested in getting on the distribution list for future issues of PSMA UPDATE, please send e-mail to: power@psma.com. Be sure to include your name and the name of your company.