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t is our pleasure to invite you to attend the 30th Annual International Symposium on Semiconductor Devices and ICs (ISPSD) that will be held May 13-18, 2018, at the Palmer House Hilton in Chicago, IL, USA. ISPSD is the world's premier forum for technical discussions in all areas of power semiconductor devices and power integrated circuits that bring together over 400 attendees and exhibitors from all fields related to power semiconductors. Main topics include, but are not limited to, device physics, modeling, design, fabrication, materials, packaging, device reliability, and device/circuit interactions for both silicon and WBG semiconductors.
Since its first meeting in Japan in 1988, ISPSD has made critical contributions to the growth of the global power semiconductor industry. Over the past 3 decades, ISPSD has enabled energy-efficient power electronic applications such as solar power, wind power, electric vehicles, data centers, and industrial drives. Most of the breakthrough power device technologies were first reported and presented at ISPSD conferences before they became large commercial successes. Come join us as ISPSD 2018 will celebrate 30 years of excellence in advancing power semiconductor technologies with a series of technical and social events. Full Day Short Course
Sunday May 13th, ISPSD will hold a full day short course that is an excellent opportunity for all students and engineers to take an in-depth look at current and emerging topics in power semiconductor and related areas. All subjects are taught by an expert in their field. This year we will have short course topics including "AlGaN/GaN Device Reliability," "Vertical GaN Devices," "SiC Design and Fabrication," "Charge Balance Si Power Devices," "Loss Mechanisms in Si and WBG Power Devices," and "Multichip Power Module Design and Assembly." Technical Sessions
The main technical sessions of ISPSD are filled with industry and academic experts giving a series of plenary talks and over 45 oral and 75 poster presentations. Highlights from key upcoming sessions and focus areas include: Plenary talks from industry experts - "ISPSD: A 30 Year Journey in Advancing Power Semiconductor Technology" Dr. Leo Lorentz (ECPE)
- "Silicon, GaN and SiC: There's Room for All" by Larry Spaziani (GaN Systems)
Superjunction MOS, Diodes and IGBTs
The sessions on Si MOS and IGBTs include 8 talks over 2 days with topics including superior switching IGBT designs (Infineon), 6.5kV IGBT design (ABB), IGBT characterization (Infineon) as well as advanced Superjunction MOSFET design and concept talks (Toshiba). Additional presentations on advanced 1200V IGBTs will be given by ABB, Toyota Motor Corp., and Toshiba). SiC Power Devices
The first SiC session will focus on state of the art SiC MOSFETs (Denso, Panasonic) followed by several talks by Infineon, TU Dortmund University, and Hestia Power focus on threshold stability and reliability of SiC devices. The second sessions with be focused on SiC reliability and ruggedness including papers on short circuit performance, body diode reliability, and modeling (Hitachi, University of Naples, Mitsubishi, and ABB). GaN Power Devices:
With the increased interest in WBG devices, GaN presentations will have at least 7 talks over 2 full sessions from expert research institutions including the University of Padova, Zhejiang University and The Hong Kong University of Science and Technology. Topics range from device optimization to reliability and characterization. Smart Power ICs:
Complementary to the GaN session, this session is focused on novel gate driver and monolithic integrated drive methods for power GaN transistors. GaN IC talks will be given by The Hong Kong University of Science and Technology, Southeast University, and the University of Toronto. Packaging and Enabling Technologies:
Critical to power semiconductor performance is the package and module technologies. In this session we will have 5 talks on topics such as 3.3kV SiC power modules from Hitachi and the University of Nottingham. Other talks on GaN, SiC, and packaging from Chemnitz University, Fuji Electric, and the University of Nottingham. Si Reliability:
To complete the comprehensive conference agenda, a session on lateral power device reliability will contain 4 talks with topics ranging from LDMOS devices (Southeast University, UESTC) to power device interconnects (Texas Instruments), and high voltage FinFETs (Indian Institute of Science). Vendor Exhibits:
In addition to the technical sessions, the conference will host Industrial exhibitions from key vendors and suppliers in the power semiconductor community. This is an tremendous opportunity to meet and learn about new products, tools, and resources available to the engineers and managers working in the power semiconductor field. Venue and Activities:
ISPSD 2018 will be held in the historical Palmer House Hilton Hotel in the beautiful and safe downtown district of Chicago. There are numerous museums, parks, theatres, restaurants, and shops within walking distance. As an added chance to network with fellow technologists there will be a special social event to celebrate ISPSD's 30th anniversary that will include an Induction of ISPSD Hall of Fame and "Ask a Founder" interviews. For those traveling with attendees, companion tours and social programs will be available (Chicago architecture tours, Chicago dinning tours, etc.).
Chicago is the third largest city in the United States with non-stop flights connecting to most major cities in Asia, Europe, and North America. This great city is an international hub for finance, commerce, industry, technology, telecommunications, and transportation. Chicago is the headquarters to 12 Fortune 500 companies and has major automotive OEMs and suppliers. Industrial equipment manufacturers within 300-mile radius include: Ford, GM, Chrysler, Delphi, Rockwell, Eaton, Johnson Control, Caterpillar, and Cummings. The city of Chicago is the birth place of modern skyscrapers and a living museum of modern architecture. We trust you and your family will enjoy your stay in Chicago!
Find more information and full technical program at: www.ispsd2018.com
Provided by David Sheridan, 2018 ISPSD Publicity Chair |
