PACKAGING is a Design Function
MANUFACTURING provides the Design Rules

he Power Sources Manufacturers Association (PSMA) is pleased to announce that the first International Symposium on 3D Power Electronics Integration and Manufacturing (www.3D-PEIM.org) will be held June 13-15, 2016, in Raleigh, North Carolina. Professionals from the world’s leading packaging and manufacturing societies and associations are bringing together designers and manufacturers to address the future of integrated power electronics design, and advance the 3D power electronics systems of the future.
The 3D-PEIM symposium is underwritten by the PSMA as part of its ongoing commitment to educate and inform the power electronics industry. Other supporting organizations include: the IEEE Components, Packaging and Manufacturing Technology Society (CPMT); the International Microelectronics, Assembly, and Packaging Society (IMAPS); North Carolina State University; the University of Maryland; and Virginia Tech.

“This symposium is all about electrical-physical design and the manufacturing of power sources.” said Doug Hopkins, PhD., Professor of Electrical Engineering at NC State and Chairman of 3D-PEIM. “Since we expect nearly everyone will have an interest in ‘physical’ circuits, we’re offering both dialogue and lecture speakers the opportunity to display their hardware during the breaks and receptions.” According to Hopkins, the symposium also offers tutorials to provide “background and insight into many physical design approaches and technologies” “We are looking forward to a full slate of presentations on topics ranging from additive manufacturing to embedded components and integrated thermal management” said Technical Program Chairs Patrick McCluskey (Univ. of Maryland) and G. Q. Lu (Virginia Tech).

The purpose of the inaugural 3D-PEIM symposium is to discuss and exchange ideas. Exhibitors are also welcomed to reserve tabletops to show what is possible in packaging and manufacturing of power electronic systems.

CALL FOR PAPERS extended to March 7.

REGISTRATION NOW OPEN. Register at the symposium’s website (www.3d-peim.org/registration).

Prof. Douglas Hopkins, General Chair
Prof. Patrick McCluskey, Technical Program Co-Chair
Prof. G.Q. Lu, Technical Program Co-Chair

Provided by Prof. Douglas Hopkins, General Chair

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