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In this issue, we would like you to meet Dusty Becker and Brian Narveson, both elected in 2013.
Dusty has been involved in the design and development of DC Rectifiers, DC-DC Converters, and DC Power Systems for both indoor and outdoor applications since joining Emerson in 1968. He has held the positions of Engineer, Design Engineer, Staff Engineer, R&D Manager, Director of Engineering, VP of Operations, VP of Systems Engineering, VP of Product Development, and currently VP of Technology. His current focus is new technology directions in the areas of Power and Outside Plant, including high power delivery systems as well as 380Vdc distribution. Dusty holds three patents and has two patents pending. He is the author of over 30 technical papers and magazine articles on the subject of DC power conversion and distribution. Dusty is a past Co- Chair for the INTELEC (PELS TC 7) Technical Committee, has served as a Committee member, session chair, and is currently a member of the INTELEC IEC. He is the Chair of INTELEC 2016. He is past Chairman of the PSMA (Power Sources Manufacturing Association) Board of Directors, a current Board member, and is Co-Chair of the PSMA Energy Efficiency committee. Dusty also sits on the NEMA Energy Storage Technical Committee as well as the recently formed IEC TAG for IEC Smart Grid Standardization. He is the sitting Emerson Representative for the NEMA Smart Grid Committee Dusty is a “Technical Expert” for IEC 22H – DC UPS work group. He is a member of the Green Grid technical committee – Power Sub-working Group, the E-merge alliance, Data & TelecomTechnical Standards Committee, the PELs Nominating Committee, and the APEC Technical Committee. Provided by Dusty Becker, Vice President of Technology, Emerson Network Power - Energy Systems
Brian has been co-chairman of the PSMA Packaging Committee for 8 years, which sponsored and facilitated the PSMA “PSiP2PwrSoC”, “3D Power Packaging” and in 2014-2015 the “Current Developments in 3D Packaging with Focus on Embedded Substrate Technologies” Special Projects all of which ended with the publication of a Technical Report . He has chaired multiple APEC Industry Sessions. In addition Brian serves on the PSMA Technology Roadmap Team where he has contributed to the sub-committee focused on DC-DC Converters and the Emerging Technology section. He has been involved with PSMA since 2001 when he became the company representative for TI. Brian has attended every APEC since 1994 except one. He was a plenary speaker at APEC 2014 speaking on the topic “Significant Developments and Trends in 3D Packaging of Power Products”. He has presented at 3 technical sessions and co-chaired and/or presented at 5 industry sessions. In 2015 he and Ernie Parker are co-chairing the industry session “3D Packaging for Power Electronics” where they have recruited 7 speakers from Industry and Academia. Brian has published over 25 power electronics articles in the US, Asia and Europe. Most were technical, but he also wrote about industry issues such as POLA vs. DOSA. Provided by Brian Narveson, President of Narveson's Innovative Consulting
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