iNEMI Workshop on Board Assembly & Test Technology

Date
Building
LVGEM Hotel, Function Room 1-2, 3F
Futian District, Shenzhen
China

Meeting Background
This day-and-a-half industry workshop will address the gaps and challenges in board assembly and test technology, including:

  • “3-D” assembly, the future of stacking parts during the standard SMT assembly process (PoP, SiP, etc.)
  • Low-temperature soldering
  • Mixed technology assemblies
  • Challenges to assembly of wearable and medical electronics
  • Challenges to reliability from new materials, technologies and product use cases
  • 3D test strategies
  • Optical Interconnect test strategies
  • HDI test solutions
  • High-speed defects evolution

The workshop will:

  • Feature speakers from OEM, EMS, equipment and material suppliers, representing different product segments
  • Review board assembly and test technology roadmaps and compare vs. industry requirements – identify gaps
  • Brainstorm collaborative options and priorities

Meeting Objectives

  • Identify issues and needs best solved by consortial activities
  • Form action groups to execute the required industrial collaborative programs