Date
Building
LVGEM Hotel, Function Room 1-2, 3F
Futian District, Shenzhen
China
Meeting Background
This day-and-a-half industry workshop will address the gaps and challenges in board assembly and test technology, including:
- “3-D” assembly, the future of stacking parts during the standard SMT assembly process (PoP, SiP, etc.)
- Low-temperature soldering
- Mixed technology assemblies
- Challenges to assembly of wearable and medical electronics
- Challenges to reliability from new materials, technologies and product use cases
- 3D test strategies
- Optical Interconnect test strategies
- HDI test solutions
- High-speed defects evolution
The workshop will:
- Feature speakers from OEM, EMS, equipment and material suppliers, representing different product segments
- Review board assembly and test technology roadmaps and compare vs. industry requirements – identify gaps
- Brainstorm collaborative options and priorities
Meeting Objectives
- Identify issues and needs best solved by consortial activities
- Form action groups to execute the required industrial collaborative programs